Meet FLEXOO at LOPEC 2026
10.02.2026
What visitors can expect at LOPEC 2026 booth B0.104
From February 25–26, 2026 at Messe München, FLEXOO will present MultiMoS, its wireless sensor platform for real‑time multiparameter sensing across industries, at booth B0.104. The platform’s ultra‑thin, flexible, and printable form factor is designed for integration in tight or hard‑to‑reach spaces while enabling high‑quality data capture at the point of origin.
MultiMoS: Wireless multiparameter sensing
At the heart of our LOPEC showcase is MultiMoS - a next‑generation sensor platform that measures multiple parameters in real time, by default pressure and temperature, and can be customized to include humidity, VOCs, gases and more. This enables condition monitoring with a single sensing solution and forms a robust data foundation for predictive maintenance and Physical AI applications.
For BESS: Early detection for safety and better economics
Battery energy storage systems are becoming critical infrastructure. On the booth, we introduce how MultiMoS supports early‑stage thermal runaway and leakage detection - wirelessly and directly inside cells, modules, or packs. The result is safer operation and more economical system performance through better, localized insights.
For industrial asset monitoring: Detecting the earliest warning signs
Industrial assets often show subtle signals long before failures occur. We show how MultiMoS captures the parameters that indicate aging, lack of maintenance, or external interference, enabling proactive interventions. Thanks to high integration and multiparameter capability at the source, MultiMoS supports predictive maintenance and the data demands of emerging Physical AI systems.
OE A Award: FLEXOO participates with two entries
FLEXOO has submitted two entries for the OE‑A Award 2026:
- Industrial asset monitoring – leakage detection, focusing on early‑stage leakage detection via wireless multiparameter sensing at the point of origin; and
- Biomechanical sensing in sports, highlighting how flexible printed sensors capture high‑resolution biomechanical data for new product concepts.
As the OE‑A Award includes a public voting element, visitors are invited to participate and support FLEXOO during LOPEC.
Design@LOPEC workshop: Collaboration between product design and technology
Dr. Jean‑Charles Flores from FLEXOO will co‑host the Design@LOPEC Workshop - a hands‑on format that brings together product designers (automotive, healthcare, wearables, fashion) and technologists in printed electronics. Participants receive expert guidance and collaborate on translating ideas into tangible prototypes. The workshop is co‑hosted with Marina Toeters (by-wire.net) and supported by industry partners.
FLEXOO is exhibiting at LOPEC 2026, Booth B0.104