FLEXOO showcases tactile-first Physical AI at HTVD 2026

FLEXOO presented its vision for tactile-first Physical AI at High-Tech Venture Days 2026 in Dresden

As AI moves into robotics and industrial systems, machines need access to physical interaction data to understand what happens at the point of contact.

FLEXOO is building the contact intelligence layer for Physical AI, combining scalable tactile sensing, physical data and models to turn contact into actionable intelligence for the next generation of systems. This approach formed the core of FLEXOO's pitch to the international investor audience at HTVD.

The discussions in Dresden highlighted the growing momentum around Physical AI and the need for real-world data to power intelligent systems.

FLEXOO presenting its tactile-first Physical AI vision at High-Tech Venture Days 2026 in Dresden.

High-Tech Venture Days 2026 brought together selected technology companies, investors and industry representatives in Dresden.