FLEXOO joins Siemens at CIIF 2026 to advance Physical AI

Participation at one of Asia's leading industrial trade fairs highlights the growing importance of physical-world data in intelligent systems

FLEXOO will participate in the China International Industry Fair (CIIF) 2026, taking place in Shanghai from October 12-16. 

This year's event comes at a time when Physical AI is moving from research and pilot projects toward industrial applications. Reflecting this development, Siemens has announced a CIIF program focused on Physical AI, industrial AI, intelligent manufacturing, and next-generation automation systems. 

As part of this initiative, FLEXOO technology will be featured in a robotics demonstrator at the Siemens booth. 

Physical AI requires physical-world data

As intelligent systems become more capable, access to reliable physical-world data is emerging as a critical requirement for real-world autonomy. 

Many industrial tasks depend not only on vision and software, but also on understanding physical interactions. Force, friction, material behavior, and contact conditions provide information that enables machines to interpret and respond to the physical world. 

The demonstrator includes a robotic gripper equipped with integrated FLEXOO sensing technology. This integration illustrates how physical interactions can be captured directly at the point of contact, providing access to data that is often difficult to obtain through conventional approaches. 

Such tactile data forms an important foundation for closed-loop robotic systems that continuously adapt their actions based on real-world feedback. 

Bringing together the Physical AI ecosystem

CIIF is one of Asia's largest industrial trade fairs, bringing together companies from robotics, automation, manufacturing, software, and digital technologies. 

For 2026, Siemens has positioned Physical AI among the central themes of its exhibition presence. Against this backdrop, CIIF provides an opportunity to exchange ideas with technology leaders and industrial innovators working on the next generation of intelligent machines. 

For FLEXOO, participation reflects the growing recognition that physical-world data is becoming a foundational element of future robotics, automation, and Physical AI systems. 

Integrated FLEXOO sensing technology enables the capture of contact, force, and interaction data directly within robotic gripping applications.